: Developing Redistribution Layers in chips. Solder Bumping : Precise placement of micro-solder balls. 🚀 Advantages of this Method No Clogging : Uses larger nozzles to produce smaller drops. Contactless : Prints on uneven or fragile surfaces.
: Building 3D structures for tissue growth. Drug Delivery : Micro-patterning medication on patches. 3. Semiconductor Packaging Jung_EHD
Traditional inkjet printers use heat or vibration to push ink out. EHD uses to pull a tiny "Taylor cone" of fluid from a nozzle. : Developing Redistribution Layers in chips
: Printing silver or copper tracks on flexible plastics. Jung_EHD
To dive deeper into Dr. Jung's specific contributions, look for: